Cadence Advances RF Design with Latest AWR Design Environment Platform

Cadence Design Systems Inc. announced AWR Design Environment Version 16 (V16) with revolutionary cross-platform interoperability to support the integration of millimeter wave (mmWave) RF intellectual property for heterogeneous technology development on the platform. design Cadence Virtuoso, industry leader. as well as the Allegro PCB and IC package design platforms. The V16 version also introduces seamless integration with Clarity 3D Solver and Celsius Thermal Solver, providing unlimited capacity for electrothermal performance analysis of complex and large-scale RF systems.

The new AWR design environment, including Microwave Office circuit design software, enables customers to efficiently design 5G wireless and connected systems for automotive, radar and semiconductor technologies and bring them to market faster. The integration of the platform and the solver in version V16 can reduce execution time (TAT) by up to 50% compared to competing workflows.

“To win in today’s highly competitive 5G / wireless markets, customers are demanding solutions that enable complete, comprehensive RF workflows that don’t just start and stop at the chip, but extend throughout. ‘whole system,’ said Vinod Kariat, vice president of the company. research and development at Cadence. “The RF workflow innovations enabled by AWR Design Environment V16 begin with a fundamental advancement in the way design data and software intellectual property are now shared and seamlessly transferred between products. Under the overall umbrella of Cadence, the level of RF integration introduced with this release is truly a leap forward for the productivity of the engineering team.

Interoperability of the platform is crucial to accelerate RF integration and promote engineering productivity. The seamless sharing of design data between the AWR Design Environment, Virtuoso, and Allegro platforms eliminates disconnection between the RF design and manufacturing layout teams, saves valuable engineering resources, and positively impacts businesses. development schedules. With the V16 version and its extensive integrated electromagnetic (EM) and thermal analyzes, customers see a reduction of more than 3 times the TAT.

The main features of this version include:

  • Allegro Integration: Ensures manufacturing compatibility and RF integration with PCB and IC package design workflows
  • Virtuoso Integration: Leverages Microwave Office for RF front-end design IP and combines it with the Virtuoso Layout Suite for IC and module integration
  • Clarity Integration: Enables EM analysis for design verification of large RF structures such as module packaging and phased array power networks
  • Celsius Integration: Provides thermal analysis for high power RF monolithic printed circuit board (MMIC) and microwave printed circuit board applications
  • AWR Enhancements: Accelerates IP RF Creation with Advances in Design Automation and Finite Element Analysis (FEA) Solver Performance

“Cadence platforms such as the AWR, Allegro PCB / SiP, and Virtuoso RF design environment with embedded EM resolution technologies are critical to the development of our RF / mmWave MMIC, RFIC, and 2.5 multichip packaging technology / 3D, ”said Florian Herrault. , Group Leader, Advanced Packaging Solutions at HRL Laboratories. “Our design team is very enthusiastic about the performance and productivity gains achieved with Cadence’s RF solutions. Having the ability to share the IP RF created in Microwave Office with our integrated circuit, our box and our team card results in a significantly reducing our overall design time so that we can deliver the highest quality products to market faster. ”

AWR Design Environment V16 supports the Cadence Intelligent System Design â„¢ strategy, enabling system-on-chip (SoC) design excellence and systems innovation. The V16 platform has been released and is now available for download.

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